About this Position
The jobholder has overall responsibility
globally for the Mobile/Telecom/5G cluster market strategy, which includes all
types of adhesives, encapsulants and thermal management materials used in the
construction of semiconductor packages. The jobholder is responsible for the
further development and implementation of the strategy and future direction of
the segment. The jobholder also takes additional regional role and responsibility to
build and guide execution of China regional semiconductor strategy
What you´ll do
- Be responsible
for the overall strategy, innovation portfolio and future direction of the
cluster. - Define and
drive semiconductor packaging business plans for the assigned cluster and
region with clear timelines and measurable outcomes, including - defining
product promotion strategies and providing the sales team with adequate
training and presentation materials, defining clear product requirements,
timelines, and pricing plans. - Provide guidance to the respective teams pertaining to the segment strategy and tactics, target applications and recommended products.
- Collect and analyze peer competitor initiatives across all business areas and their financial performance.
- Ensures consistency in market sizing methodology in the SBU for market models. Develop, track and assess economic indicators to better forecast business. Manage and extract data from in-house and externally sourced market research databases.
- Visit
customers, attend industry conferences, and meet with third party partners
on a regular basis to maintain market understanding and develop key
relationships. - Collect target cluster Macro trend to develop
technology / product roadmaps for exchange and dialogue with sales and
customers to capture future growth and sustain market segment growth. - Provide input
to the marketing communications team on the commercialization of new
products and segment specific promotional efforts. - Provide regular
reports on the performance of the segment/cluster during leadership
meetings, and to senior management as needed.
What makes you a good fit
- BS degree and above in applicable
technical or scientific discipline (Electrical Engineering, Chemical
Engineering, etc.); MBA preferred - Knowledge of
semiconductor packaging & assembly processes and material
expertise required, especially in
advance packaging field - Good strategically thinking and strong discipline on prioritized
targets - Leadership and
multicultural skills highly desirable - Excellent
communication and project management skills - Proficient in Microsoft Office
- 10+ years of
experience in semiconductor industry ideally with both engineering and
business roles. - OK with frequent travel
to China mainland for regional role support needs - 30%
Some perks of joining Henkel
- Flexible work scheme with flexible hours, hybrid work model, and work from anywhere policy for up to 30 days per year
- Diverse national and international growth opportunities
- Global wellbeing standards with health and preventive care programs
- Gender-neutral parental leave for a minimum of 8 weeks
- Employee Share Plan with voluntary investment and Henkel matching shares
- Outpatient Medical and Specialist Coverage for employees and eligible dependents
- Life, Hospital, Personal Accident Insurance Coverage
- Flexible Benefits covering Dental, Vaccination, Eye screenings etc for employees and eligible dep
- Access to company products at discounted price
At Henkel, we come from a broad range of backgrounds, perspectives, and life experiences. We believe the uniqueness of all our employees is the power in us. Become part of the team and bring your uniqueness to us! We welcome all applications across different genders, origins, cultures, religions, sexual orientations, disabilities, and generations.
