Job Description

Software (SWA) comprises the definition, specification, and allocation of requirements from different sources utilising knowledge of systems engineering processes (specification & architecture). Contains processing of use case and feature requirements into conceptual models, operational scenarios, technical requirements, and functional description. Covers specification, design, implementation, and unit testing of Software (e.g. device drivers, microcode, hardware-related software & firmware) according to the requirements and architecture defined in the systems engineering process. Covers establishment and maintenance of Software Configuration Management (SCM) practices into software development projects, continuously building and integrating infrastructure tools and systems.

• Provide support to production ramp-up phase.
• Utilize tools to evaluate/ conduct Value Analysis of a design & product through the design & production phase.
• Lead root cause analysis and corrective action activities
• Monitor and analyze product quality data to identify trends and opportunities for improvement
• Define DfM targets and collaborate with Design Engineering and manufacturing teams to ensure product designs are manufacturable and meet quality standards.
• Advanced Product Quality Planning, control plan, and process capability studies.

• Electronic, Mechanical, Mechatronic Engineer with at least 10 years’ experience in PCBA Manufacturing process & Design for Manufacturing (DFx) processes and applications from production and electronics manufacturers.
• Proven knowledge of the PCBA manufacturing processes, including stencil design (validation & revision), SMT Machine set up, tooling design (carriers, boardholder, router), Thermal profile, routing, glue, Wave Solder.
• Proven knowledge of the APQP (Advanced Product Quality Planning) process, including FMEA, PPAP, control plans, and process capability studies.
• Demonstrated experience in Electronics manufacturing processes are required, including but not limited to: Surface Mount Technology manufacturing, Thermal Solder Reflow Process, Automated Optical Inspection & XRAY inspection
• Excellent communication, including English proficiency and interpersonal skills
• With good working knowledge of Design for Manufacturing, DFM, APQP, FMEA, PPAP, GD&T, Lean Manufacturing, Six Sigma, SPC processes & tools.
• The ability to work effectively in cross-functional teams

Advancing connectivity to secure a brighter world.

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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia