Summer Semester 2027 - limited to 3-6 months
Inductive proximity sensors detect metal objects without physical contact. Detection is based on an electromagnetic field generated by a coil in a forward-facing ferrite core. The coil is part of an oscillating circuit whose characteristics are affected by the presence of a metal object. COMSOL Multiphysics simulation software is used to design and optimize such inductive frontends. It enables realistic modeling and simulation of coils, ferrite cores, and various sensor environments. Cylindrical proximity sensors have already been successfully simulated using two-dimensional axisymmetric models. For the development of cubic sensors, however, three-dimensional simulation is required to accurately represent their electromagnetic properties.
The goal of your Bachelor's thesis is to develop and validate a 3D simulation model for cubic inductive proximity sensors in COMSOL.
Contact: Sarah Disch
From factory automation to logistics automation – sensor solutions from SICK are keeping industry moving. As a technology and market leader, SICK provides sensor intelligence and application solutions that create the perfect basis for controlling processes securely and efficiently, protecting individuals from accidents, and preventing damage to the environment.
SICK is one of the world’s leading solutions providers for sensor-based applications in the industrial sector. Founded in 1946 by Dr.-Ing. e. h. Erwin Sick, the company with headquarters in Waldkirch im Breisgau near Freiburg ranks among the technological market leaders. With 63 subsidiaries and equity investments as well as numerous agencies, SICK maintains a presence around the globe. SICK has 11,804 employees worldwide and generated a group revenue of EUR 2.1 billion in the 2024 fiscal year. Additional information about SICK is available at www.sick.com
Imprint: https://www.sick.com/imprint
