Job Description

About The Position

NewPhotonics is disrupting data center processing with novel photonic engines solving the power and performance challenges.

We are seeking a an energetic and hands- on Lead process Engineer to join our OPS team.

The ideal candidate is a self-motivated hands-on Engineer capable of full process definition, and CM bring up from NPI to Mass Production.

Requirements

• 7 years + as process eng in semiconductor/ optical communication
• B.Sc./M.Sc. in science/engineering studies
• Highly motivated, organized, and independent.
• Excellent English written and verbal communication skills

Required knowledge in:

• ASIC packaging, Bumping.
• Optical coupling
• FlipCHip/ Wire bonding
• mSAP/HDI PCB design.
• GRnR , Machine introduction.
• FIB/TEM/cross section , Silicon Failure analysis.
• Manufacturing knowledge of SAP, mSAP

Key Responsibilities:

• Full Process rout definition. Product introduction to the OSATs.
• Process validation. I.e. : Wire bonding
• SOW preparation & execution
• OSAT/CM NPI bring-up and enable HVM capacity.
• Custom Machinery introduction.
• Create customer assembly guidance (Flip chip, mSAP, Dipping)
• Failure Analysis.
• Process experiment and Assembly Tech enablement.

Advantage:

• Mechanical design capabilities in SOLID
• SiPh, Optics background.
• Knowledge of GR468
• Oracle Agile.