Job Description

Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America.

The Mission

The semiconductor industry is hitting a “thermal wall.” As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Key Responsibilities

• Strategy & Product Roadmap: Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
• Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
• Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.

Requirements

• Education: PhD or MS in Mechanical Engineering, Applied Physics, or a related field with a focus on Heat Transfer and Fluid Dynamics
• Experience: 8+ years in thermal management for electronics. You have likely led thermal architecture for high-TDP processors or high-performance server systems.
• Simulation Mastery: Expert-level proficiency in thermal simulation tools. You must understand the underlying physics well enough to articulate why a GPU-accelerated or novel solver approach is transformative.
• Industry Knowledge: Deep familiarity with the roadmap of AI hardware, OCP (Open Compute Project) standards, and the transition from air to liquid cooling.

The Ideal Candidate

• You are frustrated by the slow turnaround times of current CAE software.
• You have the network to open doors at major foundries and data center equipment manufacturers.

Benefits

• Competitive compensation with equity of a fast-growing startup.
• Medical, dental, and vision health insurance.
• 401(k) Contribution.
• Gym allowance.
• Friendly, thoughtful, and intelligent coworkers.