Develop and optimize dry and wet lamination and assembly processes
Operate lamination processes (hotmelt, adhesives, UV/thermal curing)
Develop encapsulation and coating stacks
Select and qualify materials for production
Apply and optimize protective coatings and encapsulation layers for environmental and mechanical protection.
Ensure electrical and mechanical robustness of the final product
Troubleshoot lamination and interconnection defects
Perform scale-up to production
Develop SOPs, work instructions, and process documentation for lamination and assembly operations.
BS or MS in Engineering or related field
Minimum 5 years of experience in lamination ideally with flexible electronics manufacturing.
Hands-on experience with thin-film device lamination and encapsulation.
Experience with flexible substrates and R2R systems
Familiarity with lamination materials such as adhesives, barrier films, and protective coatings.
Ability to work closely with production, quality, and equipment teams in a manufacturing environment.
Experience with UVresistant encapsulation materials.
Background in lightweight, flexible electronics
Familiarity with failure modes related to lamination, delamination, cracking, or interconnect fatigue.

E-Space is a global space company focused on bridging Earth and space with the most sustainable low earth orbit (LEO) network that is expected to reach over one hundred thousand multi-application communication satellites to help businesses and governments securely and affordably access the power of space to solve problems on Earth.
Founded by industry pioneer Greg Wyler, E-Space is focused on democratizing space and transforming industries by bringing down the cost of space-based communications, raising the level of satellite system resiliency and setting a new standard in sustainable space infrastructure that will effectively minimize and reduce space debris and destruction while preserving access to space for future generations.