Job Listing Detail
Failure Analysis Support Engineer is responsible to analysis the semiconductor devices data.
Perform microscopic examinations to diagnose and troubleshoot issues.
Maintain clean, tidy and safe work space/environment.
Responsibilities
（Immediately after hiring)
Your main responsibilities will include, but are not limited to:
1. As a FIB or TEM Technician, you will be responsible for operating Dual-Beam FIB to prepare TEM samples and SEM imaging, or operating TEM for imaging, analysis.
2. Maintain clean, tidy and safe work space/environment.
(Scope of change)
There is a reassignment to the work specified by the Company.
Minimum Qualifications
1. High school graduated or above
2. Basic skills of MS Windows/OS, MS Office (Outlook/Excel/Power point/Word) are required
3. Working hours: 3-3 shift system (need to rotate day/night shift follow company rule)
Preferred Qualifications
1. Willing to learn and accept new assignments and able to handle pressure from fast-paced environment
2. Able to work independently and prioritize given tasks on hand to meet deadlines.
3. Must be a team player. Positive attitude and work ethic.
4. Good analytical thinking and problem solving abilities is a plus.
5. Abilty to communicate in English or Chinese is a plus
Working Conditions
1.Location - （Immediately after hiring) 4106-1 Haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, 869-1102 (Scope of Change) Location determined by the Company 2.Working Days & Hours - 3 day-on, 3 day-off shift (D-shift 7:20AM~7:20PM, N-shift 7:20PM~ Next day 7:20AM)
3.Benefits, Welfare - Health insurance, Employee pension, Employment insurance, Industrial accident compensation insurance, Pension plan, Retirement allowance plan, Annual leave, 4.Commuting allowance: Actual expenses (maximum 50,000 yen/month), Housing allowance (In accordance with company's regulations)
5.Business Holiday - Follow working shift
※Follows the vacation regulations according to the company calendar
6.Recruitment Process - 2-3 interviews+ Aptitude Test→ offer
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
