Responsibilities
（Immediately after hiring)
Your main responsibilities will include, but are not limited to:
1. By manufacturing area (LIT, ETCH, DIFF, TFE…) production line monitoring of tool availibility, moves achieve rate, key stage moves achieve rate
2. Schedule/Non-schedule tool monitor handling and abnormal issue inform to engineers
3. Tool loadport cleaning
4. Hot lot pushing
5. Control wafer recycle and clean FOUP preparation
(Scope of change)
There is a reassignment to the work specified by the Company.
Minimum Qualifications
1) Capable of basic English reading/ speaking ability and be able to operate computer and system interface programs
2) Able to follow detailed instructions and procedures to complete tasks and required documentation.
3) Multitasking and prioritization skills.
4) Able to work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend the majority of time (>90%, minus break time) on the factory floor working on the tools.
5) Able to work at 4-2 shifting. Each shift is 12 hours long, including night shift. (Work 3 days than take 3 day-off. Day/ night shifts will exchange every 24 days)
6) Must be legally eligible to work in Japan.
Working Conditions
1. Location - （Immediately after hiring) 4106-1 Haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, 869-1102 (Scope of Change) Location determined by the Company
2. Working Days & Hours - 3 day-on, 3 day-off shift (D-shift 7:20AM~7:20PM, N-shift 7:20PM~ Next day 7:20AM)
3. Benefits, Welfare - Health insurance, Employee pension, Employment insurance, Industrial accident compensation insurance, Pension plan, Retirement allowance plan, Annual leave, Commuting allowance: Actual expenses (maximum 50,000 yen/month), Housing allowance (In accordance with company's regulations)
4. Business Holiday - Vacation regulations：Summer vacation ※Follows the vacation regulations according to the company calendar
5. Recruitment Process - 2-3 interviews+ Aptitude Test→ offer
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
