Equipment engineers contribute to stable production by improving operating rates by improving the efficiency of equipment in semiconductor manufacturing equipment, diagnosing failures and managing vendors, and improving production lines.
Responsibilities
（Immediately after hiring)
Your main responsibilities will include, but are not limited to:
1) Handling Diffusion, Thin Film, Lithography or Etching equipment in clean room environment.
2) Install/Qualify new tool sets according to planned schedule to add capacity in a timely manner
3) Applying your experience and systematic approach to solve critical equipment issues.
4) Improving tool up-time availability and utilization efficiency.
5) Identifying and pursuing potential opportunities for hardware capability enhancement.
6) Driving defect reduction.
7) Leveraging internal and external resources to drive aggressive continuous improvement projects.
Minimum Qualifications
1) Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical, Material Science, Chemical Engineering and Automation Engineering related fields.
2) Good problem–solving and communication skills as well as a willingness to learn.
3) The ability to troubleshoot complex problems and strong ownership in providing root-cause fixes.
4) A team player who can multitask and thrive in a very dynamic and fast-paced environment.
5) Able to lift weight consistent with applicable regulations and/or safety guidelines, including NIOSH Lifting Recommendations. Able to work in a clean room environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend significant amount of time on the factory floor working on the tools.
6) Night shift work is required.
Preferred Qualifications
1) Basic mechanical-related knowledge and knowledge of semiconductor processes are a plus.
2) Previous experience in equipment maintenance or improvement is a plus.
Working Conditions
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
