Winbond

(高雄)擴散IMP / RTP設備工程師

Winbond  •  Onsite  •  4 months ago
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Job Description

【工作內容】

作為華邦的(高雄)擴散IMP / RTP設備工程師,你將參與新產品及新製程的量產導入,在生產過程中致力於優化產品品質、產能及成本,工作內容包含:

1. 離子植入、RTP、及量測機台評估,採購相關業務

2. 建廠相關廠務及機台 layout需求survey與規劃

3. 機台安裝與維修

4. 設備機台穩定性與uptime提昇

5. 設備定期保養

6. 設備維修零配件管理

7. 設備維護成本降低

8. 擴散自動化等系統條件設定及維護

9. 工廠6S / ISO宣導與執行

10. 此職務須配合大多數的工作任務,穿著無塵衣並在無塵室(FAB)中執行工作

【條件要求】

學歷要求:大學

科系要求:電機電子工程相關 │ 機械工程相關 │ 其他工程相關

相關經驗:不拘

語言能力:英文 中級

管理責任:No

輪班需求:Yes

出差需求:無

外派需求:No

其他條件:

【工作地點】

高雄(高雄市路竹區後鄉里10鄰路科五路35號)

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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