At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?
We are looking for a senior level IC packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
Knowledge in wafer level CSP, fcCSP, SiP and their corresponding applications in power management, baseband and RF.
Good understanding to advanced silicon node BEOL and device physics or component/board level reliability testing.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 5 years of experience in IC packaging.
In-depth knowledge in wafer bumping, PM/RDL fan-in & fan-out & system-in-package integration, good understanding to module process such as Cu RDL, polymer passivation, advanced node wafer singulation and die level process.
Good understanding to Chip on Wafer hybrid or fusion bonding technologies is a plus.
We’re a diverse collective of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. And the same innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it. This is where your work can make a difference in people’s lives. Including your own.
Apple is an equal opportunity employer that is committed to inclusion and diversity. Visit apple.com/careers to learn more.
