Hesai Technology

数字IC设计工程师

Hesai Technology  •  Onsite  •  4 hours ago
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Job Description

数字IC设计工程师

上海

正式

芯片类

职位描述

1.负责数字芯片系统、数字模块及数模接口的技术规范制定、系统设计、模块设计、接口设计;编写相关设计文档。 2.负责执行数字芯片系统设计、数字模块设计、数模混合接口设计等详细设计方案(包含 RTL coding、仿真、综合、时序分析等工作)。 3.负责数字芯片系统验证、数字模块验证,及参与混合信号仿真等工作;与应用工程师、模拟工程师协作完成系统测试任务,编写相关文档。

职位要求

1.硕士及以上学历,具备数字芯片设计和验证开发经验。 2.有成功流片经验,熟悉数字芯片设计/开发流程,熟练使用常用工具。 3.具有丰富的调试经验及芯片验证经验,有FPGA原型验证经验者优先。

投递

Hesai Technology

About Hesai Technology

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.

Industry
Manufacturing & Production
Company Size
201-500 employees
Headquarters
Palo Alto, California
Year Founded
2014
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