职位描述

Location: Singapore (Local Hire) 工作地点：新加坡 本地直招
Industry: Semiconductor Advanced Packaging 行业：半导体先进封装
Job Responsibilities 岗位职责
Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration.
主导本地混合键合设备整机研发、架构设计、技术攻坚与产品迭代。
Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions.
对接东南亚头部封测/晶圆厂，适配HBM、芯粒、3D堆叠工艺需求，输出设备方案。
Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging.
统筹精密结构、纳米对位、运动控制、真空温压、电控及软件系统集成调试。
Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues.
完成样机调试、精度优化、良率提升与客户验收，解决量产端技术难题。
Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production.
管理本地研发团队，制定研发规范，整合本地供应链，推进本地化量产。
Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.
跟进前沿技术，完成技术预研与专利布局，推动产品市场化落地。

职位要求

Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master preferred.
本科及以上，机械、自动化、微电子、半导体装备相关专业，硕士优先。
10+ years semiconductor packaging equipment R&D experience, 5+ years Hybrid Bonder complete machine development & mass production experience.
10年以上封测设备研发经验，5年以上混合键合整机开发及量产落地经验。
Master nano-level alignment, bonding temp-pressure control, vacuum system design, familiar with advanced packaging process.
精通纳米对位、键合温压控制、真空系统设计，熟知先进封装制程。
Hold valid Singapore working pass & familiar with local semiconductor industry resources is preferred.
持有新加坡合法工作身份、熟悉本地产业资源优先。
Fluent English, able to work independently in full English working scenario.
英文流利，可独立适配全英文工作场景。
Experienced in R&D team management, strong project management & cross-team communication skills, able to work under pressure.
具备研发团队管理经验，项目统筹与沟通能力强，抗压性良好。