Winbond

(中科)Flash製程整合工程師

Winbond  •  Onsite  •  1 month ago
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Job Description

作為華邦的(中科)Flash製程整合工程師,你將協同每段線上的製程夥伴,致力於提高產品良率,確保品質一致性。工作內容包含:

1.新產品導入及良率提升
2.製程/產品量產、良率與製程條件最佳化
3.異常產品之分析與改善
4.Flash 電性參數監控系統之建立與改善
5.Flash 異常電性參數分析及警示
6.Flash 測試鍵電性參數之編輯與量測
7.Flash 元件特性分析及寬容度調整
8.支援各項稽核工作
9.相關生產力提升之程式撰寫(Ex: Python/PBI...etc)

【工作地點】 中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】

學歷要求:碩士
科系要求:資訊工程相關
相關經驗:1年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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