【工作內容】
作為華邦的(竹北)Field Application Engineer，
1. Pre-sales service for Flash products: Design in hardware and software support, product spec and technical QA.
2. After-sales service for Flash products: Handing of failure analysis cases, replication of defective issues, technical issue responses. Include on-site support.
3. Third party service for Flash product: Third party product, Programmer and Evaluation Board, design in support.
4. Assistance with exhibition support, exhibition booth setup, and on-site personnel explanations.
【工作地點】竹北辦公室(新竹縣竹北市文興路二段539號)
【條件要求】
學歷要求：大學
科系要求：電機電子工程相關 │ │
相關經驗：3年以上
語言能力：英文 高級 │ │
管理責任：No
輪班需求：No
出差需求：1個月以下
外派需求：No
其他條件：
1. Knowledgeable in Embedded system design.
2. Knowledgeable in Linux/Unix/U-boot systems.
3. Basic programming reading and writing abilities.
#LI-KL1
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
