Job Description

• Assist FA engineers in performing failure analysis on customer’s RMA returns and internal engineering requests
• Learn and perform hands-on in electrical fault isolation and defect characterization at both IC (or silicon level) and power supply
• Inspect and document incoming RMA returns both at IC’s and Power Supply levels
• Support electrical debugging activities, including performing impedance measurements, ATE test, and curve tracing of IC’s
• Work with senior engineers to analyze test data and perform physical analysis (e.g., optical microscopy and CSAM/SEM imaging)
• Support FA engineers in data collection, documentation and contribution to technical reports

• Gain hands-on experience in semiconductor failure analysis workflows
• Develop understanding of electrical fault isolation and physical analysis techniques
• Learn to interpret I-V curve and ATE test datalogs
• Build practical knowledge of FA tools such as XRAY, CSAM, probing systems, SEM/FIB
• Learn technical reporting and communication skills
• Develop collaboration experience in engineering environments

• Document failure analysis findings with observations and preliminary conclusions
• Data summaries and failure trend insights
• Contributions to root cause analysis under engineer supervision
• Presentations summarizing internship work or failure case studies

• Fundamental knowledge of analog and digital circuits
• Basic understanding of semiconductor device physics and IC fabrication processes
• Exposure to lab tools such as curve tracer, Oscilloscopes, Source meters, and DMM
• Basic technical report writing and documentation skills

• Completed academic projects that required using S/W tools such as Cadence/Synopsis, MATLAB, Spice etc.. to design, simulate, assemble, and test the design at final products
• Hands-on lab or academic project experiences in device/PCB level characterization
• Familiarity with IC/PCB-level schematics and layout
• Understanding of analog, mixed-signal, or power IC operation
• Exposure to some failure analysis techniques such as optical micro-scopes, XRAY, and SEM