Job Description

Meet the Team

As a Failure Analysis Engineer, you will be part of the Quality and Reliability group, performing failure analysis of ASIC products. Should have a passion for problem solving and a strong technical background in semiconductor failure analysis techniques and root cause analysis.

You have experience with a variety of semiconductor failure analysis techniques and test equipment is required, along with the ability to interpret results and provide clear guidance on causes of failure.

Your role will require high level of collaboration and interaction with Product Test Engineering, Design Engineering, Quality Engineering, Assembly Engineering and Foundry Engineering teams.

As a successful candidate, you must be able to work well within a team and have excellent communication and organizational skills.

Your Impact (Responsibilities)

• Conduct root cause failure analysis of silicon product reliability test and field failures and propose corrective actions.
• Develop and implement standard processes for failure analysis using all types of FA techniques and equipment.
• Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way.
• Document and report failure analysis results to management.
• Function as a technical resource for failure analysis questions.
• Develop and maintain relationships with FA service and equipment vendors.

Minimum Qualifications

• Bachelors degree in Electrical/Electronics Engineering or related required. Masters preferred.
• 10+ years of experience in semiconductor failure analysis field.
• Proven ability to write and execute FA plans and interpret results from FA techniques such as cross section, X-ray, CSAM, TDR, FIB, SEM, and TEM, IR/EMMI/OBIRCH.
• Proven ability to specify hardware and implement set up for dynamic FA using SIL (Solid Immersion Lens) and LSM (Laser Scanning Microscopy).
• Working knowledge of fault isolation techniques using ATE, Scan/ATPG, MBIST to identify, isolate and characterize device-level faults.

Preferred Qualifications

• Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
• Good understanding of transistor function/basic electronics, semiconductor device physics and behavior under various operating conditions
• Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
• Experience with semiconductor frontend fabrication, backend assembly, ASIC testing, and discrete component failure analysis.
• Proven experience driving physical failure analysis with suppliers.

Soft Skills

• Interface with product, test, and design engineering groups to identify and characterize faults on emerging technologies, while providing fault isolation, identification, and characterization for yield/reliability failures.
• Enjoy hands-on work and working in a lab environment.
• Good customer and vendor management skills.
• Ability to work well in cross-functional teams in a fast-paced, collaborative team environment.

Why Cisco?

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.