Join TSMC Washington and help power the future of technology. At TSMC, we don't just make semiconductors; we innovate to transform industries and enhance lives. As the world’s leading semiconductor foundry, we partner with top tech companies to drive advancements in industries such as healthcare, automotive, consumer electronics, and renewable energy. At TSMC Washington, you'll thrive where innovation meets precision manufacturing, and integrity guides our high standards and customer trust. Our visionary leaders collaborate with clients to achieve groundbreaking results, ensuring our leadership in the semiconductor sector. Explore career opportunities with TSMC Washington and join a company with a commitment to excellence and innovation.
TSMC Washington is seeking a proactive and detail-oriented Junior Equipment Engineer to join our Thin Film Equipment (TFE) team, specializing in Chemical Vapor Deposition (CVD) equipment. In this role, you will be responsible for maintaining tool availability, optimizing preventative and corrective maintenance procedure, reducing tool downtime, and sustaining high-yield semiconductor manufacturing operations in a 24/7 cleanroom environment. This position offers extensive hands-on training and mentorship from senior engineers to build a strong foundation in advanced semiconductor equipment engineering. .
Perform routine preventive maintenance (PM), calibration, and troubleshooting on CVD tools (e.g., HDP,PECVD, SACVD from major vendors such as Applied Materials, Lam Research).
Respond promptly to tool alarms and line-down events to restore normal production while minimizing mean time to repair.
Monitor tool health, particle performance, thickness uniformity, and Statistical Process Control (SPC) charts to prevent process excursions.
Partner closely with CVD Process Engineers to qualify equipment modifications, new parts, and recipe implementations.
Support root cause analysis (RCA) on chronic tool issues and component failures.
Collaborate with senior engineers on equipment upgrade projects, spare parts management, and maintenance cost-reduction initiatives.
Author, review, and standardize Standard Operating Procedures (SOPs) and maintenance checklists.
Strictly adhere to cleanroom protocols, environmental health and safety (EHS) guidelines, and hazardous chemical/gas handling procedures.
Work inside the cleanroom wearing full personal protective equipment (PPE / bunny suit).
Participate in shift handover routines and support on-call or rotation/compressed work-week schedules as required by 24/7 fab operations.
Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, Mechatronics, Physics, or a related STEM field.
Experience: 0–2 years of experience in equipment maintenance, cleanroom manufacturing, electromechanical troubleshooting, or relevant academic lab/internship projects.
Basic understanding of vacuum systems, RF power delivery, gas delivery/MFCs, thermal controls, robotics, or pneumatic systems.
Familiarity with data analysis tools (e.g., Excel, SPC) and basic statistical concepts.
Strong problem-solving mindset and willingness to work hands-on with hardware inside a cleanroom.
Solid written and verbal communication skills; ability to document complex mechanical procedures clearly.
Strong team player capable of coordinating effectively across operations, process engineering, and vendor support teams.
Previous internship or co-op experience within a semiconductor wafer fabrication plant or flat-panel display facility.
Hands-on familiarity with Applied Materials (AMAT Producer/Centura) or Lam Research (SEQUEL/SPEED) deposition platforms.
Basic understanding of CVD film deposition mechanisms, precursors, and plasma physics.
This position operates on-site at our Camas, Washington location during core business hours, Monday through Friday 8 am – 5 pm; however, there may be occasions when additional hours are necessary to meet project demands.
TSMC Washington, LLC is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.
TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at recruitingwa@tsmc.com. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law.
At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work:
(For more details on TSMC’s Core Values, please visit: https://www.tsmc.com/english/aboutTSMC/values
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
