Job Description

Location(s)

Tamsui District, New Taipei

Company

Molex

Career Field

Engineering

Job Number

190633

Your Job

We are seeking individuals who are proactive, humble, eager to learn new skills, and demonstrate strong potential for growth. Our R&D/Product Development Engineering Teams generate original ideas for innovative products and guide their development from concept to mass production.

About the Role

This position focuses on the development of next-generation liquid cooling solutions for AI servers, data centers, and high-power electronics applications. The engineer will lead the design and development of advanced cold plate technologies, innovative coolant flow architectures, and emerging joining/welding processes to enable higher thermal performance, reliability, and manufacturability. The role requires strong expertise in thermal-mechanical design, fluid flow optimization, and advanced manufacturing technologies to drive new product innovation from concept to mass production.

Our Team

Molex creates connections for life by enabling technologies that transform the future and improve lives. With a presence in more than 40 countries, Molex offers a complete range of connectivity products, services and solutions for the data communications, medical, industrial, automotive and consumer electronics industries. Our team is helping the company establish a leading position in these areas while creating or providing mechanical and thermal solutions.

What You Will Do

Next-Generation Liquid Cooling Product Development

• Lead the development of next-generation liquid cooling products and thermal management solutions for high-performance computing and AI infrastructure.
• Define product architecture, design concepts, and technology roadmaps for future liquid cooling platforms.
• Evaluate emerging cooling technologies and drive innovation to improve thermal performance, reliability, and cost competitiveness.

Advanced Cold Plate Design & Development

• Lead the design and development of advanced cold plates, including high-performance internal structures and thermal enhancement features.
• Develop innovative cold plate architectures to support increasing heat flux requirements and next-generation processor platforms.
• Collaborate with thermal engineers to optimize thermal resistance, pressure drop, manufacturability, and system integration.

Coolant Flow Path & Manifold Architecture Design

• Develop innovative coolant flow path designs and manifold architectures to improve cooling efficiency and flow distribution.
• Optimize internal channel structures, flow balancing strategies, and pressure drop performance through simulation and experimental validation.
• Apply CFD analysis and design methodologies to achieve superior thermal-fluid performance.

Advanced Joining & Welding Technology Development

• Lead the development and qualification of new cold plate joining technologies, including vacuum brazing, laser welding, friction stir welding, diffusion bonding, and other advanced manufacturing processes.
• Collaborate with suppliers and manufacturing teams to evaluate process capability, reliability, and scalability.
• Drive process innovation to improve product performance, yield, and production efficiency.

End-to-End Product Development

• Lead product development from concept, prototype, design validation, and qualification through mass production.
• Establish design verification plans, reliability requirements, and manufacturing readiness criteria.
• Drive DFM, DFA, and cost optimization activities throughout the product lifecycle.

Who You Are (Basic Qualifications)

• Bachelor’s or Master’s degree in mechanical engineering, Thermal Engineering, or a related field.
• 7~10+ years of experience in thermal and mechanical design.
• Proficiency in CAD software (e.g., NX, Creo, SolidWorks).
• Familiarity with End-to-End Development (Concept to Production)
• Experience with manufacturing processes (e.g., CNC machining, stamping, plating, injection molding, LSR molding, Rubber Molding Process).
• Experience with mechanical & thermal design and, testing requirements.
• Excellent problem-solving and analytical skills, able to deeply analyze testing failure mode and with a focus on manufacturability and quality control.
• Demonstrated experience working with cross functional teams in English.
• Tolerance stack-up Analysis for CAD and product specification definition, review thermal and reliability testing report.

What Will Put You Ahead

• Hands-on experience in advanced cold plate design and liquid cooling product development.
• Strong knowledge of coolant flow path optimization, manifold architecture design, and CFD analysis.
• Experience with advanced joining technologies such as vacuum brazing, laser welding, diffusion bonding, friction stir welding, or seal welding.
• Experience developing liquid cooling solutions for AI servers, data centers, HPC, or telecom infrastructure.
• Deep understanding of heat transfer, fluid dynamics, thermal interface materials, and cooling system reliability.
• Proven track record in bringing innovative thermal products from concept to mass production.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

Who We Are

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.

Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.

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