About AI Division Software Organization
The AI Division (AIDIV) at Ceva combines the agility of a startup with the foundation of a leading, established IP provider. Our core portfolio includes a family of NPUs supporting LLMs, classical CNNs, and Audio & Voice AI, with integrated DSP capabilities. We focus on delivering advanced embedded software and graph compiler solutions that push the boundaries of performance and efficiency. Our mission is to make cutting-edge AI broadly accessible—powering applications in AR/VR, 3D processing, and Generative AI, while seamlessly integrating with classical algorithms for Audio, Voice, SLAM, Vision, LiDAR, and more.
Lead the development of Ceva Sensing SDK, a core software toolkit that integrates a broad set of computer vision, audio, and voice libraries, along with AI operators. The SDK is specifically designed and optimized for Ceva’s latest NPUs and DSPs - NeuPro-M, NeuPro-Nano and SensPro2 - positioning it as a cornerstone of Ceva’s sensing and AI platform.
Key Responsibilities:
Lead and mentor a team of software engineers developing Ceva Sensing AI SDK. Architect and implement high-performance sensing SW components for AI, vision, Audio and voice optimized for vectorize SIMD execution. Collaborate with compiler and DevOps teams to ensure efficient development and deployment. Drive technical excellence through code reviews, design discussions, and continuous improvement. Own the SDK roadmap, planning, and delivery cycles. Engage with customers to enable successful pre-sale processes, support integration and gather feedback.
Advantages:
Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.
