Winbond

(中科)行動記憶體DRAM產品工程師

Winbond  •  Onsite  •  2 hours ago
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Job Description

(中科)行動記憶體DRAM產品工程師

【工作內容】

作為華邦的(中科)行動記憶體DRAM產品工程師,你將負責把關產品生產週期的每一道關卡,確保產品良率、性能及品質。工作內容包含:

  1. DRAM新產品導入量產階段(CPR/PR/APR/光罩改版統整)
  2. DRAM產品PKG(FT)量產良率的提升與改善
  3. DRAM產品失效的電性解析
  4. 協助異常處理和品質監控
  5. 各項PKG工程議題支援(YEM/TTO/Quality improvement)
  6. 支援客戶稽核需要

【條件要求】

學歷要求:碩士

科系要求:電機電子工程相關 資訊工程相關

相關經驗:不拘

語言能力:英文 中級

管理責任:No

輪班需求:No

出差需求:

外派需求:No

其他條件:

  1. 具備DRAM測試概念/元件物理特性尤佳
  2. 熟悉Excel工具(巨集)
  3. 了解AI相關概念和能力尤佳
Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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