【工作內容】
作為華邦的(高雄)先進DRAM開發製程整合工程師,您需要:
1.先進製程DRAM開發
2.製程調整與數據分析
3.良率提升
【條件要求】
學歷要求:碩士
科系要求:工程學科類(全部)
相關經驗:3年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1. 具備DRAM開發經驗尤佳
2. 具備Layout解讀能力與test key設計尤佳
3. 具備process integrate能力與defect reduction能力尤佳
4. 具備WAT測試分析能力與了解半導體元件物理尤佳
5. 具備CP測試分析能力與了解DRAM電性運作原理尤佳
6 .具備 Excel 巨集程式編輯能力尤佳

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.