【工作地點】 高雄(高雄市路竹區後鄉里10鄰路科五路35號)
【工作內容】
作為華邦的(高雄)DRAM製程缺陷改善工程師(定契),你將協同每段線上的製程夥伴,致力於提高產品良率,確保品質一致性。工作內容包含:
1. 新製程/產品之缺陷改善、產品良率、品質之提升
2. Defect Inspection Tool recipe setup
3. 異常產品缺陷即時分析及工程問題分析與改善
4. 工程實驗分析、缺陷系統開發
5. 支援客戶稽核作業並滿足客戶合理需求
【條件要求】
學歷要求:碩士
科系要求: │ │
相關經驗:不拘
語言能力:英文 中級 │ │
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No
其他條件:

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.