Job Description

Altera is seeking a highly skilled and motivated Design Thermal Engineer to contribute to the thermal design, analysis, and optimization of our cutting-edge semiconductor products. This role involves ensuring robust thermal performance and reliability across various product lines.

As a key member of Full Chip Global Power Intent Thermal Team, you will be responsible for all aspects of FPGA Power Intent and Thermals. Responsibilities include Thermal verification of die, package, software and board. Good cross functional collaboration needed to verify, debug, and signoff system level Thermal closure. In addition to thermal closure, you will get experience working on power intent verification using UPF, power electrical rule checking, power rollup at die and package level, and system EM and IR closure, die package bump and ball planning.

Qualifications:

The successful candidate's minimum qualifications will include the following:

• BS/MS in Mechanical Engineering
• Industry experience for minimum of 4 years
• Familiar with thermal tools
• Experience with UPF, Verdi, Redhawk, power IR/EM, physical design, and power on sequence is a plus
• Comfortable with PERL/Python, TCL, Linux Shells
• Excellent execution and strong drive to close complex design issues
• Good communication and presentation skills to enable cross functional interaction

Job Type:

Regular

Shift:

Shift 1 (India)

Primary Location:

Bengaluru, Karnataka, India

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.