About the Business Unit
The Mobile Broadband Business Unit (MBBU) at Ceva is a leading innovation hub developing advanced modem and Digital Signal Processing (DSP) ASIC solutions for next-generation wireless communication systems. Our team drives cutting-edge projects that power devices across the mobile broadband ecosystem, including satellite terminals, IoT devices, 5G base stations, private networks, and emerging low Earth orbit (LEO) satellite platforms. We specialize in high-performance, power-efficient architectures that enable robust connectivity, scalable deployment, and advanced signal-processing capabilities.
About the Role
The System team defines and develops cutting-edge 5G technology. In this role, you will lead the system team responsible for defining our next-generation modem products and developing modem algorithms, working at the intersection of research, system design, and implementation.
Responsibilities
Lead a team of senior system and algorithm engineers responsible for developing innovative 5G modems.
Partner closely with VLSI and SW teams implementing the modem HW and SW and align on system definitions with implementation constraints.
Develop and maintain deep expertise in cellular standards and their implications for modem design.
Lead system and algorithmic research, balancing trade-offs between DSP/SW/HW implementations, performance, implementation cost, real-time constraints, and time-to-market.
Own system definitions, requirements, and implementation from initial research through simulation to official release, including MATLAB/C/C++/SystemC modeling and specification documentation.
Mentor and grow team members, fostering technical excellence and professional development.
Advantage

Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.