Job Description

Role Purpose & Mission

Role Purpose

Establish and lead Commercial Technology engagement with Taiwan-based original design manufacturers (ODMs) serving hyperscale, and AI/HPC neocloud data center customers. The role connects ODM technology roadmaps and rack-level integration needs with Corning optical connectivity, product development, manufacturing, and commercialization capabilities.

Role Mission

Become the trusted technical interface for priority ODMs in Taiwan, influencing architecture and design choices early, converting customer and ecosystem insights into scalable solutions, and supporting programs from concept and proof of concept through validation, new product introduction, and mass production.

Primary Focus Areas and Key Responsibilities

Primary Focus Areas

• Taiwan ODM ecosystem and strategic account development
• AI data center scale-up, scale-out / rack-to-rack optical connectivity
• Rack-level integration, pre-cabled and pre-tested systems, and deployment readiness
• Design wins and proofs of concept, including support from EVT (Engineering Validation Test), DVT (Design Validation Test), PVT (Production Validation Test), and NPI (New Product Introduction) through commercialization
• Voice of customer and voice of technology for regional and global product roadmaps
• Cross-functional execution across Sales, Product Line Management, Technology, Engineering, Operations, Supply Chain, Quality, and Marketing

Key Responsibilities

ODM relationship and account leadership

• Build trusted relationships across ODM engineering, design, architecture, sourcing, product, program, operations, and executive teams.
• Act as primary Commercial Technology contact for assigned Taiwan ODMs and coordinate the broader internal account team.
• Develop account technology plans, relationship maps, opportunity priorities, and engagement cadences.
• Identify design-win opportunities in AI server, rack-scale, networking, and integrated data center platforms.

Technical discovery and solution development

• Lead discovery on platform roadmaps, GPU and switch architectures, topology, protocol, fiber density, connector and shuffle requirements, rack constraints, validation plans, and timing.
• Create high-level recommendations for point-to-point, structured, semi-structured, shuffle-harness, shuffle-box, trunk, patch-panel, and optical-backplane applications.
• Translate ODM requirements into actionable inputs for application engineering, PLM, technology, manufacturing, and quality.
• Guide proof-of-concept and prototype work, including sample definition, design review, technical risk identification, and success criteria.

Program execution and commercialization

• Convert customer-specific learning into repeatable platforms, reference designs, value propositions, and scalable market plays.
• Escalate technical, quality, schedule, or supply risks early and drive cross-functional closure.

Market intelligence and enablement

• Monitor Taiwan ODM roadmaps, AI infrastructure trends, competitive solutions, manufacturing models, and buying behavior.
• Provide structured voice-of-customer and voice-of-technology updates to regional and global stakeholders.
• Deliver technical and commercial presentations, workshops, training, and sales-enablement content for ODMs and internal teams.
• Represent Corning at customer meetings, industry forums, and relevant regional events.

Success measures

• Earlier and deeper access to priority ODM architecture and platform roadmaps.
• Qualified design wins with clear scope, stakeholders, value proposition, and next steps.
• Effective transition from concept to prototype, validation, and repeatable production.
• Improved cross-functional execution, issue visibility, and speed of decision-making.
• Reusable reference designs, account insights, and enablement materials.
• Strong customer credibility across engineering and commercial stakeholders.

Experiences/Education - Required

• Bachelor's degree in engineering or a related technical discipline; equivalent relevant experience will be considered.
• At least 5 years of relevant experience in data center infrastructure, servers, networking, optical connectivity, high-speed interconnects, telecommunications, or electronics manufacturing.
• Experience working with ODMs, OEMs, contract manufacturers, semiconductor or system partners, or complex technology accounts.
• Ability to translate architecture and product requirements into actionable solution plans.
• Experience coordinating Sales, Engineering, Product Management, Operations, Manufacturing, Supply Chain, and Quality.
• Excellent communication, presentation, documentation, and stakeholder-management skills.
• Fluent Mandarin Chinese and business-fluent English, written and spoken.
• Ability to travel and collaborate across regional and global time zones.

Experiences/Education - Desired

• Knowledge of AI/HPC architectures, GPU clusters, Ethernet and InfiniBand fabrics, leaf-spine networks, rack-scale systems, and scale-up/scale-out connectivity.
• Knowledge of optical connectivity, including MPO/MTP, very-small-form-factor connectors, trunks, harnesses, patch panels, polarity, insertion-loss budgets, cleaning, inspection, and testing.
• Experience with rack integration and EVT, DVT, PVT, NPI, qualification, and mass production.
• Experience supporting design wins, proofs of concept, reference architectures, or joint go-to-market activity.
• Familiarity with Taiwan ODM operating models, decision networks, sourcing practices, and global customer programs.