COB工艺开发工程师
上海
正式
硬件类
职位描述
1.负责COB(Chip on Board)封装的工艺开发、优化与量产导入,覆盖Die Bond、WireBond、点胶、固化(Curing)及检测(AOI/测试)等关键工序; 2.设计和执行DOE验证以优化工艺参数窗口,推进从早期开发、工艺验证、小批验证到量产导入的全流程,确保COB工艺满足量产要求 3.主导或配合完成新工艺、新材料、新治具、新设备的导入评估和考核,包括胶水/焊线/劈刀/设备等 4.持续优化工艺制程,提升良率,配合处置客诉及内部不良分析
职位要求
1.本科及以上学历,优先微电子科学与工程、电子封装技术专业,其次是材料科学与工程、集成电路科学与工程、半导体物理等相关专业; 2.熟悉半导体封装基础知识,了解Wire Bonding/Die Bonding等基本工艺流程; 3.具有良好的动手能力和实验设计思维,能独立完成工艺实验,同时具备基础的数据分析能力,能使用MINITAB、JMB等数据处理软件进行数据处理; 4.具备良好的沟通协作能力,能跨部门与生产、质量等多部门密切合作,推动COB封装方案的落地与优化; 5.具备一定的抗压能力,有较强的问题解决能力,能够快速应对COB工艺开发过程中的突发异常或困难; 6.有微纳加工、封装工艺、半导体工艺等相关项目/实习经历者优先
投递

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.