Winbond

(中科)CMP製程工程師

Winbond  •  Onsite  •  2 hours ago
Apply
AI can make mistakes so check important info. Chat history is never stored.

Job Description

(中科)CMP製程工程師

【工作內容】
作為華邦的(中科)CMP製程工程師,你將參與新產品及新製程的量產導入,在生產過程中致力於優化產品品質、產能及成本,工作內容包含:

1.12吋CMP製程技術開發及導入量產
2.新製程材料評估
3.線上製程維護
4.Cost down/ 產能提升/SPC改善
5.專案及系統開發

【工作地點】

中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】
學歷要求:碩士
科系要求:工程學科類(全部) │ 化學相關 │ 自然科學學科類(全部)
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No
其他條件:

1.具備CMP製程開發經驗尤佳,無經驗新鮮人可
2.具備 Python 或其他程式語言經驗尤佳
3.熟悉資料科學/ AI 應用尤佳
4. 能配合輪班

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
Social Media