Minimum qualifications:

• Bachelor's degree in Electrical/Computer Engineering, Computer Science, a related technical field, or equivalent practical experience.
• 10 years of experience in advanced packaging technology and high-volume production development.
• Experience with optical sub-assemblies, including CPO, silicon photonics, VCSELs, and micro-LED integration.
  

Preferred qualifications:

• Experience translating technical product requirements into packaging specifications.
• Experience working within assembly houses or wafer foundries.
• Knowledge of 2.5D/3D/3.5D heterogeneous integration (interposers, TSVs, RDL, micro-bumping, high-density substrates).
• Understanding of end-to-end manufacturing flows, photonics fab processing, assembly processes, and reliability (component/board level).
• Command of physical architecture, high-speed electrical/thermal performance, and thermo-mechanical constraints (warpage, materials).

About the job

As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs). You will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. Your focus will span optical packaging technologies, design tradeoffs, assembly evaluation, mechanical reliability, and qualification, seeing systems through to high-volume manufacturing.

Responsibilities

• Own product and packaging architecture for next-generation optical modules (e.g., CPO, uLED, VCSEL) and define manufacturing strategies for Tensor Processing Unit (TPU) packaging solutions.
• Bridge hardware domains from silicon architects to platform teams, managing technical trade-offs across manufacturing, electrical, thermal, and mechanical parameters.
• Drive advanced packaging concepts to high-volume manufacturing, proactively mitigating technical risks and authoring assembly processes and reliability test plans.
• Lead cross-functional initiatives guiding new designs and test vehicles through qualification and New Product Introduction (NPI) phases.
• Develop and scale the external supply chain vendor ecosystem while providing project management and clear communication across internal stakeholders and global suppliers.