Job Description

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
• 2 years of experience working in a electrical engineering technical environment.
  

Preferred qualifications:

• Bachelor’s or Master's degree in Electrical Engineering, Computer Engineering, or related field.
• 3 years of experience in the consumer electronics industry, including imaging products.
• Experience in debugging and failure-mode analysis.
• Proficiency in Electronic Design Automation (EDA) tools (e.g., Cadence Allegro, Altium) and simulation tools (e.g., SPICE).
• Familiarity with camera modules, image sensors, or optical components.

2 years of experience working in a electrical engineering technical environment.2 years of experience working in a electrical engineering technical environment.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.

Responsibilities

• Determine component-level requirements and develop schematics for camera modules containing image sensors, microcontrollers, AF/OIS drivers, and high-speed interfaces (MIPI, I2C, SPI). Design hardware to enable testing and future technology innovation.
• Perform schematic capture, Printed Circuit Board (PCB)/flex layout supervision, and simulations to meet high-speed signal integrity and low-noise power supply requirements.
• Bring up prototypes, conduct system-level debugging, and test electrical subsystems for performance over specified temperature and voltage ranges.
• Author comprehensive design documentation, Design for Manufacturability (DFM) reports, and Design Failure Mode and Effects Analysis (DFMEA).
• Work with cross-functional teams (Optical, Mechanical, Firmware) to optimize camera performance and ensure successful integration.