About the Business Unit
The Infrastructure team is part of the broader VLSI department within the AI-DIVISION, enabling the development of state‑of‑the‑art AI processors, DSPs, and hardware accelerators for advanced ASIC products in AI, vision, wireless, and base‑station domains.
The Infrastructure team provides cross BU, cross site support in the domains of CAD, DevOps, emulation, and automation infrastructure that supports design, verification, and release flows across multiple product lines.
About the Role
We are looking for an Infrastructure Team Leader to lead and manage a highly skilled team of 4-5 engineers, responsible for Emulation, CAD, DevOps, compute infrastructure, and automation.
This role combines 50% hands‑on and 50% manageiral technical leadership and end‑to‑end ownership of infrastructure, tooling, and release flows.
The position has a significant impact on productivity, quality, and time‑to‑market of the company’s silicon products and is reporting directly to the director of the department.
Responsibilities
Lead and mentor the Infrastructure team, including CAD, DevOps, automation, and emulation activities.
Own the definition, development, and maintenance of infrastructure: Emulation, design flows, verification flows, releases, automation, TFS Azure DevOps and CI/CD pipelines.
Drive continuous improvement of infrastructure reliability, performance, scalability, and usability.
Take end‑to‑end responsibility, cross BU, cross site VLSI releases, environments, and production readiness.
Collaborate closely with different stakeholders in the HW and SW RnD teams to align infrastructure with project needs.
Advantages
Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.
