About the Business Unit:.
Ceva's VLSI department in the AI Devision develops state‑of‑the‑art AI processors, DSP cores, and hardware accelerators for ASIC solutions across AI, vision, wireless, and base-station domains. The team is responsible for delivering advanced silicon technologies powering next-generation products.
About the Role:
As a CAD Engineering Student, you will join an experienced CAD, DevOps, and Emulation team, working on cutting-edge VLSI infrastructure. You will support automation, release processes, and emulation flows while gaining hands-on exposure to full chip development environments.
Responsibilities:
Support VLSI infrastructure, automation flows, and release processes.
Assist in developing and maintaining CAD/DevOps scripts and tools
Participate in emulation activities and environment setup
Collaborate with design and verification teams to improve engineering efficiency
Advantages:
Please attach updated grades sheet
Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.
