Job Description

We are looking for a CAD and Integration Engineer to join our custom silicon team. Working in close partnership with circuit designers, digital designers and layout engineers, you will translate circuit intent into physical constraints, drive synthesis, place-and-route, and signoff, and bridge the gap between schematic and silicon. You will also play a key role in enabling 3D stacking flows between heterogeneous process nodes. Beyond implementation, we expect a builder's mindset: developing automation tools, improving CAD flows, and actively leveraging AI-assisted design to increase team-wide engineering velocity.

Responsibilities
Integrate AI/LLM tools into workflows to drive design automation and engineering productivity
* Lead analog mixed signal physical integration and enforce design constraints in collaboration with design and layout teams
* Manage end-to-end digital implementation flows (RTL-to-GDS), including synthesis, PNR, DFT insertion, and signoff
* Drive physical signoff (timing, power, verification) to ensure foundry-ready deliverables
* Develop 3D stacking flows for heterogeneous integration and die-to-die interface planning, cross-die timing and power analysis
* Automate implementation, tapeout, and regression using Python, SKILL, and Tcl

Qualifications
Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
* BS/MS/PhD in EE, CE, or a related field with 12+ years of industry experience
* Proven industry experience in analog CAD/automation support areas involving various technology nodes and tapeouts
* Expertise in full RTL-to-GDS flow, digital synthesis, PNR, and physical signoff
* Proficiency in analog mixed signal design environment and simulation tools
* Knowledge of PDK and Spice model qualification
* Strong programming skills in languages such as SKILL, Python, Perl etc. to provide automation needs
* Hands-on experience with AI coding assistants
* Experience communicating technical decisions and project status to cross-functional partners, including circuit designers, layout engineers, and foundry contacts Familiarity with advanced packaging technologies and their implications for chip-level CAD methodology and integration flows
* Experience with hierarchical chip integration and assembly flows for large, multi-block SoCs targeting consumer electronics or wearable device applications
* Experience with low-power design methodologies including multi-voltage domain integration, UPF-based power intent, and power analysis sign-off for mobile or wearable silicon
* Experience engaging directly with foundry partners on process design kit development, design rule updates, and technology qualification for leading-edge nodes