Hesai Technology

工艺规划工程师(bonding)

Hesai Technology  •  Hangzhou, CN (Onsite)  •  5 months ago
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Job Description

工艺规划工程师(bonding)杭州全职智能制造 / 工业互联网 / 工业自动化职位描述1、根据项目产品需求,负责产品COB封装部分产线规划,包含芯片固晶,胶水固化,打线,AOI,上电测试等工艺,制定产品COB封装线体技术方案,编制线体预算和实施计划。
2、根据项目要求,管理线体规划和落地,在规定时间内完成设备选型,统筹和协调线体搭建,设备调试,小批量试产,量产导入,设备验收等;
3、根据线体规划,制定合适的COB封装工艺路线和参数,编制产品P-FMEA,控制计划,SOP,各工序开班点检,设备点检等线体工艺文件,并对生产员工进行操作培训指导;
4、负责COB封装线体爬坡和量产工艺持续提升,优化线体&工艺设计和验证,降低成本,提升生产效率和良率,达成线体规划良率和效率指标;
5、参与所负责线体的APQP和PPAP;
6、持续提升公司COB封装技术能力。职位要求1、具有半导体芯片COB封装5年以上工艺&设备经验;
2、熟悉固晶机,打线机,晶圆分选机,Plasma, AOI检测等半导体设备原理,功能和操作,有ASM封装设备经验优先;
3、熟悉COB工艺设备相关上下料方法,有自动化上下料及MES经验者优先;
4、有COB封装项目管理经验,有良好的沟通能力,资源整合和协调能力,能够统筹和指导方案落地。 投递
Hesai Technology

About Hesai Technology

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.

Industry
Manufacturing & Production
Company Size
201-500 employees
Headquarters
Palo Alto, California
Year Founded
2014
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