Job Description

Location:​Alhambra, CA​

The Backend Process Engineer –InPWafer Fab positionis responsible fordevelopment, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),andautomated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.

Responsibilities

Backend Process Ownership and Optimization (35%)

• Own andoptimizebackend waferfabprocesses including lapping/thinning, n-side metallization, and RTA

• Establish robust process windows, recipes, and control limits for backend modules

• Maintain stable manufacturing performance through continuous monitoring and improvement

Yield Improvement, Defect Reduction, and AOI Control (25%)

• Own and maintain AOI processes for backend defect detection and yield monitoring

• Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations

• Analyze inline and post-process data toidentifytrends and systematic issues

• Implement corrective and preventive actions and verify effectiveness

Singulation,OpticalCoatings, and Packaging Interface Support (20%)

• Support cleaving, dicing, and singulation processes to ensure device integrity

• Provide process engineering support for AR/HR optical coatings and vendor qualifications

• Collaborate with packaging, device, and reliability teams to ensure packaging readiness

New Product Introduction and Technology Support (10%)

• Support new product introduction (NPI), process transfers, and technology changes

• Evaluate backend process risks associated withnew designs, materials, and device structures

Documentation, Process Control, and Manufacturing Support (10%)

• Author andmaintainSOPs, travelers, process specifications, and control plans

• Define SPC metrics and control strategies for backend processes

• Provide hands-on manufacturing and troubleshooting support as needed

Minimum Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field

• Minimum of 3+ years of experience inbackend semiconductor processing

• Hands-on experience with lapping/thinning, metallization, and thermal processes

• Understanding ofInP-based or III-V compound semiconductor wafer fabrication processes

• Experience with AOI systems, yield analysis, and data-driven process improvement

• Strong understanding of singulation, packaging interfaces, and reliability requirements

• Proficiencyin SPC, DOE, and statistical analysis

• Ability to work across cross-functional manufacturing and engineering teams

• Preferred experience withInPor III-V optoelectronic devices

• Familiarity with AR/HR optical coating processes

• Experience supporting high-mix, low-volume manufacturing environments preferred

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essentialjobfunctions and requirements and are subject topossible modificationtoreasonably accommodateindividuals with disabilities.

A reasonable estimate of the pay range for this position is $100,000 - $135,000.  There are several factors taken into consideration indeterminingbase salary, including but not limited to: job-related qualifications, skills,educationand experience, as well as job location and the value of other elements of an employee’s total compensation package.

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