Job Description

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies. This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

Essential Responsibilities:

• Support new semiconductor technology from early development phase through volume manufacturing phase, including full documentation to support ONSEMI’s process change review process.
• Work with a global matrixed team while driving projects and results independently.
• Effectively communicating with all levels of the organization, including the executive staff.
• Operating independently, while taking high-level objectives into account.
• A team player with strong listening skills who can take input and make informed decisions.
• Using probe, in-line test, and failure analysis data to develop and drive process improvements.
• Drive cost reduction through yield enhancement and process simplification.

Required Qualifications:

• Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement.
• Education: BS in Engineering or Material Science, MS or PhD preferred
• Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development.
• Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc.
• Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred.
• Assembly processing and advanced module construction are positive.
• Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc.
• Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA
• Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution.
• Knowledge of assembly and package interconnect processes preferred.
• Experience using predictive thermo-mechanical simulations is preferred.
• Language Fluency – Fluent in English Language, written & verbal

Salary: onsemi is excited to share the base salary range for this position is$114.000 to $193,700 exclusive of fringe benefits or potential bonuses.The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits