Job Description

Main Task
1. New business development
- Scout business opportunities and identify technical requirements; cooperate with relevant teams for feasibility study
- Execute and coordinate product promotion projects; includes hosting technical meetings, resource coordination/planning, sampling, product registration, internal qualification, piloting, improvement, scaling up until product ready for commercialization
- Act the major interface between customer and product development team during product promotion process
2. Market intelligence management
- Collect and analyze industry trend and customer technology roadmap to support product development direction
- Scout and summarize competitor activities and competitive landscape to support product strategy and sustain company competitiveness

Requirement
1. Education: Bachelor or Master degree in an engineering and scientific field, such as Materials Science, Chemistry, Electrical Engineering, Chemical Engineering, is preferred
2. Work Experience
3+ Years in the field of semiconductor industry.
Experience in new business development project management in preferred
Experience in technical sales or a customer-facing role is preferred
Etch Module Process Engineering (Wet clean), Thin Film Module Process Engineering - Electrochemical Deposition (ECD) or PIE (Process Integration Engineer)
Research Development (AMTD), Technical Development (TD) and material related (Wet Clean, Cu/Co plating, CMP slurry/post clean) background is preferred
3. Technical & Professional Knowledge
Good understanding of semi-conductor process and technology is necessary; knowledge of wet process and chemicals (Focused on BEoL/MEoL) & Cu/Co plating are a MUST
Strong interpersonal and communication skills is required
English Skill: Oral & Written (Professional Terminology in Semiconductor Process terms)
Proven ability in coordinating and leading cross-functional teams (GPM, QC/QM, ADL, CoE, SCM, Sales & etc.)
请时刻警惕任何可能的招聘欺诈行为！请注意，巴斯夫绝不会在任何情况下向候选人以任何形式收取任何费用。