Job Description

Application Engineer

Bangkok, Thailand · Full-time · 80,000–100,000
THB/month · 3 openings · 5+ years' experience

About the Role

Evantis Talent
Solutions is recruiting on behalf of a global leader in semiconductor assembly
and advanced packaging equipment. This is an opportunity to join a highly
technical team at the forefront of die bonding and advanced packaging
technology, working directly with customers across the APAC region.

As an Application
Engineer, you will develop and optimise die bonding processes, run customer
sample evaluations in the demo room, and provide hands-on application support
both remotely and on-site at customer facilities.

Key Responsibilities

• Develop die bonding processes
  and conduct customer sample evaluations in the demo room
• Prepare presentations and
  application reports for customers and internal stakeholders
• Deliver process training,
  application support, and optimisation of die bonding and advanced
  packaging processes — remotely or at customer sites across APAC
• Support internal teams and
  distributors on process-related topics
• Take ownership of the demo
  machine pool and associated facilities
• Travel across the APAC region
  as required

Requirements

• Bachelor's Degree in
  Engineering (Master's Degree preferred)
• Minimum 5 years of relevant
  experience
• Hands-on experience with
  assembly equipment (SMD Mounter, Die Bonder) — required
• Proven experience developing
  die bonding processes, ideally within an NPI (New Product Introduction)
  department of an OSAT facility, across a broad variety of product types
  rather than a single product line
• Working knowledge of CAD
  software (SolidWorks basics)
• Proficiency in Microsoft
  Office
• Strong English communication
  skills, written and spoken
• Willingness and ability to
  travel frequently across APAC