INTRODUCTION

This position is basedinonethe APEC offices of DuPont, a global leader in protective materials.
As Application Development Engineer, you will play a pivotal role in supporting customer needs by driving the development of new applications,byleadingthe development of new productsandprovidingexpert technical guidance on the use, handling, and management of DuPontTyvek®products.

ROLE & RESPONSIBILITIES

In this role, you will:

Industry & Customer Engagement:

• Act as the primary technical interface between DuPont and semiconductor customers across Taiwan and the broader APAC region.

• Develop strong relationships with wafer manufacturers, OSATs, advanced packaging companies, IC substrate producers, packaging material converters, and equipment suppliers.

• Lead technical discussions, application reviews, product evaluations, and qualification activities with customers.

Application Development

• Drive the development of new Tyvek® applications in interleafing & active packaging.

• Identifyunmet customer needs and translate them into application concepts, product requirements, and commercialization opportunities.

Technical Leadership

• Serve as the internal subject matter expert (SME) for semiconductor packaging, contamination control, ESD management, moisture protection, and interleafing applications.

• Lead root-cause investigations and problem-solving activities related to particle contamination, ionic contamination, ESD performance, material handling, automation compatibility, and product performance.

• Collaborate closely with global R&D, Product Management, Manufacturing, and Quality teams to develop andoptimizesolutions.

Product Qualification & Commercialization

• Support customer qualification activities through test planning, data analysis, and performance validation.

• Generate technical evidence supporting key customer requirements

• Drivespecification-inactivities and support commercial adoption.

QUALIFICATIONS

Education & Experience:

Required

• Master’s degree inElectronicEngineering,Physics,Material Science,Chemical Engineering,ora related field

• Minimum 5 years of experience in semiconductor materials, packaging materials, wafer handling, contamination control, semiconductor packaging, substrate manufacturing, or related applications.

• Proven experience working directly with semiconductor customers in technical development, process engineering, application engineering, or product development roles.

• Experience supporting cleanroom manufacturing environments.

• Experience leading customer-facing technical projects from concept through commercialization.

Preferred

• Experience with semiconductor interleafing, wafer separators, IC substrate packaging, desiccants, cleanroom packaging, ESD packaging, or contamination-control materials.

• Familiarity with semiconductor ecosystem companies such as foundries, memory makers, OSATs, substrate manufacturers, and packaging converters.

• Knowledge of wafer fabrication, advanced packaging, chiplet architectures, AI/HPC supply chains, or semiconductorlogistics

• Experience with material qualification and semiconductor quality requirements.

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Skills & Competencies: