Job Description

Conduct design and development of image sensor technologies, work on transistor level design of analog and mixed-signal circuits for CMOS Image Sensor such as asic_pixel array, column-amplifier, comparator, ramp generator, ASRAM and XDEC by using Cadence Virtuoso; Work on whole chip floorplan design and pad frame; Work on analog and mixed signal circuits layout design by Cadence Virtuoso, such as column_array; Collaborate with layout engineer on whole chip layout integration and improvement by Cadence Virtuoso; Perform sub-blocks and whole image sensor readout circuit simulation by simulators such as Analog FastSPICE (AFS), Empyrean ALPS and NanoSpice; Perform design verification such as DRC, LVS, PERC check by using Siemens Calibre; Perform whole chip IR drop check by using Ansys Totem; Conduct script modification using Perl programming language; Collaborate with Digital Engineer to define and design the analog to digital interface; Collaborate with verification, process, test, and application engineers to debug, characterize and optimize performance of fabricated image sensors; Analyze project-specific specifications, such as speed, linearity, noise, power consumption, etc, and improve circuit designs or implement innovative solutions to meet performance requirements; Define corners based on chip operating conditions, ensuring the chip meets specifications and operates reliably with sufficient margin for robustness under all conditions; Propose innovative and creative solutions along with new circuit R&D and be ahead of current technology.Requirements:Master’s degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or related fields. Require coursework in Analog Integrated Circuit and Power Electronics Design.Require knowledge or skills of:• Analyze analog and mixed-signal circuits; troubleshoot and resolve circuit issues;
• Design analog/mixed-signal circuits based on specifications; optimize for higher performance;
• Perform circuit simulations using tools such as Cadence Spectre or HSPICE;
• Understand layout impact on circuit performance; apply layout strategies to minimize adverse effects;
• Knowledge of semiconductor device physics and its influence on circuit behavior;
• Analyze and mitigate thermal, flicker, and shot noise in analog designs;
• Knowledge of integrated circuit fabrication processes and incorporating process variation considerations into schematic and layout design.
• Design and analyze power management circuits, including LDOs and charge pumps.Annual base salary for this role in California, US is expected to be between $125,000 - $135,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.

About OMNIVISION

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications.

Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology.

Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity:

• Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed®

• First to commercialize backside illumination technology in 2007 (OmniBSI™)

• Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications

• Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm

• Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine

• Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules

• First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles

• First to introduce RBG-Ir technology to medical

Industry

Hardware & Semiconductors

Company Size

1,001-5,000 employees

Headquarters

Santa Clara, CA

Year Founded

1995

Website

ovt.com

Social Media

Analog Design Engineer

Job Description

About OMNIVISION