Hesai Technology

AME Bonding工艺规划工程师-杭州

Hesai Technology  •  Hangzhou, CN (Onsite)  •  5 months ago
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Job Description

AME Bonding工艺规划工程师-杭州杭州正式制造类职位描述1、协助COB封装线体规划,参与贴片、打线等工艺环节的技术方案实施与数据整理;
2、参与设备选型与导入流程,协助完成设备调试、试产及验收相关文档记录;
3、支持工艺参数验证与优化实验,协助收集分析数据并整理报告;
4、参与编制工艺文件,协助维护SOP、FMEA等技术文档的更新与管理;
5、协助解决生产现场工艺问题,参与不良品分析与改进措施跟踪;
6、跟踪封装技术动态,协助收集行业前沿信息与技术资料整理。职位要求1、全日制本科及以上学历,微电子、材料、机械或自动化相关专业;
2、了解半导体封装基本流程,有COB封装或相关制造业实习经验者优先;
3、具备基础数据分析能力,能熟练使用Excel,了解CAD或SolidWorks者优先;
4、具备良好沟通能力和团队协作精神,能适应无尘室工作环境。 投递
Hesai Technology

About Hesai Technology

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.

Industry
Manufacturing & Production
Company Size
201-500 employees
Headquarters
Palo Alto, California
Year Founded
2014
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