Job Description
• Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
• Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
• Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
• Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
• Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
• Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
• Evaluate airflow distribution in control panels, switchgear assemblies, and electronic enclosures
• Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities
• Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations
• Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
• Support verification and validation (V&V) activities, including comparison with test data using engineering metrics
• Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits
• Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
• Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies
• Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture
- Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
- 4–8 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and thermal-fluid simulations (internships and thesis work may be considered)
- Strong fundamentals in:
- Fluid mechanics and basic turbulence modeling
- Heat transfer (conduction, convection, radiation)
- Thermodynamics relevant to electronics cooling
- Hands-on exposure to CFD model setup, solution execution, and result interpretation
- Familiarity with at least one commercial simulation tool such as:
- ANSYS Icepak, ANSYS Fluent
- Siemens FloTHERM / FloEFD
- STAR-CCM+, COMSOL, or similar software
- Basic understanding of mesh generation and grid quality concepts, solver settings and convergence behavior
- Structured modeling workflows and technical guidelines
- Good written and verbal communication skills, with ability to explain results clearly
• Self-motivated, detail-oriented, and comfortable learning in a technically rigorous environment - Exposure to electronics thermal management, including:
- ICs, PCBs, power electronics
- Heat sinks, fans, vents, and enclosures
- Awareness of electronics packaging constraints such as:
- Space limitations, airflow resistance
- Material properties and power dissipation
- Basic experience with thermal testing, such as thermocouple placement, temperature measurement, or data acquisition
• Introductory experience correlating simulation results with test or experimental data - Familiarity with transient thermal behavior, power cycling, and reliability considerations
- Exposure or interest in industrial products such as circuit breakers, PLCs, switchgear, or control panels
- Interest in automation, scripting, or AI-assisted simulation workflows
