Ceva is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world.
CEVA is looking for an experienced and highly motivated Senior AI Field Application Engineer to join our team.
As part of Ceva’s sales team for the Americas, you will be based remote and will have the responsibility for supporting customers and tracking customer information (project/technical). The ideal candidate will bring a high level of energy and enthusiasm, be goal-oriented and have a deep sense of customer service.
This position will require cooperation and interaction with Ceva’s global R&D, corporate application engineers, and the US sales team. You will frequently interact with existing and potential customers to evangelize the technical value of Ceva’s products during pre-sales engagements and facilitate the customer’s integration and use of Ceva’s products post-sales.
Responsibilities:
• Promote Ceva’s AI/ML products by highlighting their technical merits, by addressing customers’ questions, and by driving technical evaluations.
• Understand customer’s technical requirements and identify the right AI/ML technology/solution to meet and exceed the customer’s expectations.
• Drive customer evaluations in collaboration with Ceva’s Sales and R&D.
• Assist customers with the integration of Ceva’s Neural Processing Unit (NPU) IP, provide technical training and enable optimal use of Ceva’s NPU IP in the customers’ designs.
• Help the US Sales & Business Development team to penetrate new accounts and identify potential customers for Ceva AI offerings.
• Build and develop relationships with existing and potential customer’s technical teams and technical management.
Job Requirements (Must-Have):
• Bachelor’s or master’s degree in electrical engineering (BS/MS EE) or a closely related technical field.
• 6+ years of experience in AI/ML development, including:
• A collaborative individual with a positive attitude, excellent communication skills, and the ability to articulate technical concepts.
• Passionate about solving technical challenges, with a business and customer-focused mindset.
• Self-driven, independent, and assertive. A problem solver who can drive issues to closure with little to no supervision.
• Able to travel frequently within the U.S. to meet customers and internationally a few times per year.
• Flexibility to work across time zones (US-Europe).
• Legal work authorization/EAD for U.S. employment.
Job Requirements (Nice-to-Have):
• 10+ years’ experience in development of complex system architectures and sophisticated SoC designs.
• Proven customer-facing and customer-support skills acquired in a previous FAE or AE role
• Good knowledge of DSP applications in common consumer electronic devices (e.g., Cellular/Telecommunications, 5G, Wireless/Connectivity, Voice & Audio)

Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.