Winbond

(中科)製程整合暨AI應用工程師

Winbond  •  Onsite  •  4 months ago
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Job Description

(中科)製程整合暨AI應用工程師

【工作內容】
作為華邦的(中科)製程整合暨AI應用工程師,你將支援企業內各項領域的運作,確保公司各項業務的有效運轉。工作內容包含

(1) 產品良率、品質與可靠度之提升
(2) 製程條件最佳化及寬容度調整
(3) 支援稽核與客戶服務工作
(4) 電性參數量測監控及異常分析及警示
(5) 新製程、產品之導入與量產
(6) 配合AI部門設計與開發AI良率平台
(7) 建立AI Agent的推理流程紀錄機制,持續優化系統穩定度
(8) 開發AI平台,使用Prompt語法自動化日常重複性步驟


【條件要求】
學歷要求:碩士
科系要求:電機電子工程相關 │ 數學及電算機科學學科類(全部) │
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1.資工系佳,具python經驗
2.個性積極、負有高度責任感及團隊精神尤佳


*本職缺開放安排周六、日面試

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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