Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies—incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).
You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.
In this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.
PhD and 6+ years of experience in relevant industry, preferred.
Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).
Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
Broad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
Excellent communication and collaboration skills across cross-functional hardware teams.
BS and 10 +years of relevant industry experience
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Apple is an equal opportunity employer that is committed to inclusion and diversity. Visit apple.com/careers to learn more.
