XPENG

【27届暑期】SOC芯片设计实习生

XPENG  •  Onsite  •  12 days ago
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Job Description

【27届暑期】SOC芯片设计实习生上海实习研发 - 电子 / 半导体职位描述1. 参与自研 SoC 模块的架构制定、方案设计和 RTL 编码实现,完成 RTLQA(Lint/CDC/DFT/RDC等) 交付检查流程。
2. 配合 验证团队,Review 验证计划,定位并修复功能缺陷,确保代码覆盖率达标。
3. 配合 中后端 团队完成 时序/面积/功耗 的收敛优化;支持 FPGA/Emulator 原型验证。
4. 支持 回片后调试及性能/功耗测试。职位要求1. 硕士及以上学历,微电子、电子工程、集成电路、计算机、自动化等相关专业。
2. 熟悉数字电路与逻辑设计,掌握 Verilog/SystemVerilog 语言。
3. 了解 ASIC 开发设计流程(RTL→Synthesis→DFT->PD)及前端常用 EDA 工具(VCS/VERDI/SpyGlass 等)。
加分项:
1. 熟悉高速接口协议/设计 (DDR/PCIE/USB/ETH/UFS/MIPI), 熟悉 AMBA(CHI/ACE/AXI/AHB/APB)总线协议,有 NPU/CPU/ISP/视觉 等模块课程设计或在校项目经验者优先。
2. 具备脚本能力(Python/Tcl)者加分;有实际流片或 FPGA 项目经验优先,有芯片开发岗的实习经验优先。
3. 有参与 芯片/FPGA 相关竞赛的主要参赛经历及获奖者,有发表过芯片设计相关论文或专利者优先。
4. 英语 CET-6 以上,能快速阅读专业文献与协议规范。
5. 具备良好的沟通能力和团队协作精神,对芯片技术有持续热情。 投递
XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
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