XPENG

【27届校招】芯片封装设计工程师

XPENG  •  Onsite  •  7 hours ago
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Job Description

【27届校招】芯片封装设计工程师
上海
正式
研发 - 电子 / 半导体
芯片板块
职位描述
1. 负责SoC芯片封装选型的方案评估与对比分析,包括封装形式(BGA、LGA、WLCSP等)、引脚数、基板层数、尺寸及成本等关键参数的综合考量,识别并规避封装实现中的风险点(如bump密度、信号出线可行性、电源分配网络等)。
2. 配合芯片后端设计团队,统筹整理bump布局的规划与优化,独立完成bump/ball map的绘制、版本维护及设计规则检查,确保布局满足封装工艺和电气性能要求。
3. 负责封装基板(Substrate)layout设计中的评审文档整理、版本管控及设计变更追踪,参与设计Review会议并输出会议纪要及行动项跟踪。
4. 参与封装材料(ABF/BT基板、underfill胶、TIM热界面材料等)的选型评估与供应商技术沟通,建立材料参数库,为设计选型提供数据支撑。
5. 协同工艺、可靠性及测试团队,参与封装方案的可行性评审,推动封装设计从概念到量产的顺利落地。
6. 跟踪先进封装技术趋势(如2.5D/3D封装、Chiplet、Fan-Out等),参与技术预研与内部规范制定,提升团队封装设计整体能力。
职位要求
1. 学历专业:本科及以上学历,微电子、电子工程、机械工程、材料科学与工程等相关专业。
2. 理论基础:具备扎实的半导体封装基础知识,理解芯片封装流程、基板结构、互连方式(引线键合/倒装焊)及常见封装失效模式。
3. 工具能力:熟练使用至少一种电子设计或绘图工具(如Allegro Package Designer、Altium Designer等),有实际的封装或PCB设计项目经验(含课程设计)。
4. 业务理解:了解封装设计中信号/电源完整性的基本约束,能理解bump/ball map设计中对SI/PI的考量要求。
5. 软技能:工作细致认真,具备良好的文档编写习惯和跨团队沟通协调能力,能主动跟进任务闭环。
6. 抗压能力:具备较强的学习内驱力,能快速适应研发项目节奏,按时交付高质量成果。
投递
XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
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