XPENG

【27届校招】嵌入式硬件开发培训生

XPENG  •  Onsite  •  9 hours ago
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Job Description

【27届校招】嵌入式硬件开发培训生
广州
正式
智能制造 / 工业互联网 / 工业自动化 - 研发
职位描述
1. 根据产品的开发流程,与需求方对接功能需求,并转化为硬件详细需求与硬件方案;
2. 负责开展车载ZCU、BMS、IPU硬件研发工作,完成原理图绘制、PCB布局布线评审、器件选型、BOM整理核对等基础设计工作,完成产品硬件迭代优化。
3. 负责完成单板硬件调试、功能验证、协助完成性能测试及可靠性摸底测试,协助排查基础硬件故障,输出基础分析报告。
4. 学习汽车电子研发规范与车规标准,协助团队完成硬件设计文档、测试报告、FMEA、WCCA等研发资料的编制、整理与归档工作。
5. 跟进项目研发、试样及小批量试产进度,配合软件、结构、测试、供应链等跨部门协同工作,协助解决研发及生产过程中的基础硬件适配问题。
6. 具备AI+硬件融合基础,了解AI辅助电路设计基础知识者优先
职位要求
1.全日制硕士及以上学历,电子信息、电气工程、微电子、自动化、车辆工程(车载电子方向)等相关专业。
2. 具备扎实的模电、数电、电路分析理论基础,熟练掌握电阻、电容、MOS管、运放、电源芯片、车载MCU等常用器件的工作原理及应用场景。
3. 掌握基础硬件测试方法,熟练操作示波器、万用表、直流电源等常用测试仪器,具备基础单板调试能力。
4. 心态踏实主动,抗压能力良好,具备持续解决问题的意愿。
5.拥有车载硬件、电源设计、电路板开发相关科创竞赛、科研项目、毕业设计经验优先
投递
XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
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