XPENG

【27届暑期】芯片封装设计实习生

XPENG  •  Onsite  •  11 days ago
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Job Description

【27届暑期】芯片封装设计实习生上海实习研发 - 电子 / 半导体职位描述1. 在导师指导下,参与SoC芯片封装选型的信息收集与对比,评估封装领域常见的实现风险点(如bump密度、信号出线、电源分配等)。
2. 配合芯片后端团队整理bump布局相关数据,在导师指导下完成bump/ball map的基础绘图或数据维护。
3. 协助封装工程师整理基板layout设计过程中的文档、版本及评审材料。
4. 协助团队整理封装相关材料(ABF/BT基板、underfill胶、TIM等)的选型资料。职位要求1. 在读本科或研究生,微电子、电子工程、机械、材料等相关专业,2027年或2028年毕业。
2. 对芯片封装或硬件设计有一定了解。
3. 至少会使用一种绘图或设计工具(如Allegro、Altium Designer)。
4. 做事细心、有条理,有较好的文档整理和沟通能力。
5. 具备良好的学习能力和团队协作精神,每周可实习4天及以上,连续实习1个月以上。 投递
XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
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