2027届校招-3DIC系统工程师
北京、上海、深圳
校招
正式
研发 - 电子 / 半导体
职位 ID：A247880
职位描述
1、负责3D异构集成与系统技术协同优化（STCO）确保跨尺度的通道满足电源完整性以及信号完整性的需求； 2、负责3D堆叠中热管理方案与系统散热方案设计，确保可以满足芯片温度需求； 3、负责3D异构集成与STCO等前沿领域技术研究与方案仿真验证，突破现有多DIE堆叠方案中的电、热等性能的瓶颈，帮助实现更优的"存算" 性能； 4、应用先进封装技术，参与解决3D异构集成中热-力-电多物理场耦合问题。
职位要求
1、2027届毕业，微电子、集成电路、电子工程、材料物理、机械热流体等相关专业硕士及以上（热设计方向博士优先）； 2、深入掌握半导体物理、器件物理、电路理论、传输线理论、计算流体力学、有限元分析等知识； 3、熟练掌握Synopsys/Cadence/ANSYS/Mentor/COMSOL等一种或者多种仿真平台工具； 4、具备良好的沟通能力和团队协作精神，工作认真负责，以客户为导向，能够自我驱动。 加分项： 1、参与过3DIC或者其他多DIE堆叠的先进封装项目； 2、参与过AI/GPU等大尺寸、高功耗芯片的设计，了解AVFS/DVFS feature或者其他功耗or热管理方案； 3、参与过高速D2D通信接口或者UCIE/PCIE Gen5+/LPDDR5X+/HBM2E+相关的芯片项目。
投递
Founded in 2017, Witmem focuses on the field of computing-in-memory chips, innovatively uses Flash memory to complete the computing-in-memory of neural networks, solves the problem of AI storage walls, improves computing efficiency and reduces costs.
The R&D team is formed by Dr. Wang Shaodi and Dr. Guo Xinjie in conjunction with a number of scholars and industry practitioners. They have an average of more than 10 years of industrial work experience.
Witmem's WTM2101 chip is suitable for low-power AIoT applications, and can complete large-scale deep learning operations with microwatt to milliwatt power consumption, especially suitable for intelligent voice and intelligent health services in wearable devices, and has completed mass production and market applications . WTM8 series chips are aimed at 6-48Tops computing power products and are used for real-time processing of 4K-8K video.
In January 2023,Witmem announced the completion of the B2 round of financing. In the future, Witmem will continue focusing on the field of computing-in-memory chips and lead the industrialization of computing-in-memory.
Website: https://en.witmem.com/
YouTube: https://www.youtube.com/@Witmem2017
Headquartered in Beijing, China.
